Crosstalk analysis of carbon nanotube bundle interconnects

Stability analysis in multiwall carbon nanotube bundle interconnects

Based on the transmission line model (TLM), we present an exact and general transfer function formula, useful for both single multiwall carbon nanotube (MWCNT) and MWCNT bundle interconnects. Using the standard parameters for 22-nm technology node we perform the Nyquist stability analysis, to investigate the dependence of the degree of relative stability for both single and bundle interconnects...

Temperature Dependent Analysis of Mixed Carbon Nanotube Bundle as Vlsi Interconnects

Taguchi Approach and Response Surface Analysis for Design of a High-performance Single-walled Carbon Nanotube Bundle Interconnects in a Full Adder

In this study, it was attempted to design a high-performance single-walled carbon nanotube (SWCNT) bundle interconnects in a full adder. For this purpose, the circuit performance was investigated using simulation in HSPICE software and considering the technology of 32-nm. Next, the effects of geometric parameters including the diameter of a nanotube, distance between nanotubes in a bundle, and ...

A Thermal Model for Carbon Nanotube Interconnects

In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT)...

Analysis of Single Wall Carbon Nanotube Interconnects &Comparison with Copper Interconnects at Different Technology Nodes

This paper investigates the performance of the bundle of Single wall Carbon Nanotubes (SWCNT) for low-power and high-speed interconnects for future VLSI applications. The power dissipation and delay of SWCNT bundle interconnects are examined and compared with that of the Cu interconnects at the different technology (16nm, 22nm, 32nm & 45nm) nodes for both intermediate and global interconnects. ...